Tecbond® 7718 12 Black Polyamide Adhesive (100)

Tecbond® 7718 is a black, low viscosity polyamide hotmelt adhesive with excellent heat resistance. This material is perfectly suited to be used when potting and encapsulating electrical components.

It offers a very fast setting time, with no mixing , no waste and no mess! 7718 offers a simple and cost effective solution for quick encapsulation jobs. Preventing corrosion, and ensuring long-term integrity of a device or electrical compounds. Tecbond® adhesive flows easily into the smallest of cavities. This material also lends itself well to the woodworking industry - and can be used to fill in missing or damaged knots.