TECHSiL's Top 10 Thermal Management Materials

Momentive TIG210BX Silicone Grease

Thermal conductivity 2.1 W/mK 1-Part non-flowable, repairable silicone grease Gives a thin bond line Wide operating temperature range (-40°C ~ 150°C) Very low bleed out & weight loss, stays in place

Momentive TIA0260 Silicone Adhesive

Thermal conductivity 2.6 W/mK 1-part semi-flowable silicone paste Room temperature curing (TFT 10 mins) UL94 V-0 Good adhesive properties

Momentive TIA350R Silicone Adhesive

Thermal Conductivity 3.5 W/mK Excellent heat dissipation 1-part, heat cure, silicone paste Low temperature fast cure Cures to a 77 Shore A, tough rubber Thermal interface between dies and heat spreaders