TECHSiL's Top Thermal Management Materials

Momentive TIG210BX Silicone Grease

Thermal conductivity 2.1 W/mK 1-Part non-flowable, repairable silicone grease. Gives a thin bond line. Wide operating temperature range (-40°C ~ 150°C) very low bleed out & weight loss, stays in place

Momentive TIA0260 Silicone Adhesive

Thermal conductivity 2.6 W/mK 1-part semi-flowable silicone paste, Room temperature curing (TFT 10 mins) UL94 V-0 approved with good adhesive properties. Contains 180 micron glass beads.

Momentive TIA350R Silicone Adhesive 

Thermal Conductivity 3.5 W/mK. Excellent heat dissipation 1-part, heat cure, silicone paste. Low temperature fast cure Cures to a 77 Shore A, tough rubber. Thermal interface between dies and heat spreaders.

TECHSiL® TIM11123GB Thermal RTV Silicone

200 micron, self-gapping, non-corrosive, 1-part room temperature vulcanising (RTV) silicone rubber, thermal conductivity of ~2.3 W/m.K. Non-corrosive to copper or its alloys and offers primerless adhesion to many substrates. Flowable and contains glass beads to control bond line thickness.

TECHSiL® TIM11150 GB Thermal RTV Silicone

Contains 50 µm self gapping glass beads, self-gapping, 1-part room temperature vulcanising (RTV) silicone rubber, thermal conductivity of ~2.3 W/m.K. Non-corrosive, fast skinning with low linear shrinkage. 67 Shore A.

TECHSiL® 1084g Thermally Conductive Silicone Paste

1-part room temperature vulcanising (RTV) silicone rubber, thermal conductivity of ~2.3 W/m.K. Non-corrosive, fast skinning with low linear shrinkage. 67 Shore A.

Momentive SilCool TIA208R Thermally Conductive Potting Silicone

UL940V-0 approved 2 component, thermally conductive silicone used for potting and gap filling. Convienent 1:1 mixing ratio and it's flowability allows it to conform to complex 3-dimenstional shapes and cavities, filling voids and thereby creating a thermal path to remove heat.