Thermal gap filling is a crucial aspect of thermal management in electronic devices, specialist materials are used to bridge the thermal gaps between heat-generating components (like microprocessors, LEDs, or power transistors) and heat-dissipating elements (such as heat sinks or housings). These materials are typically soft, conformable, and thermally conductive, allowing them to fill air gaps that naturally occur due to surface irregularities or manufacturing tolerances.

There are a few types of thermal gap fillers available:

Silicone-Based Gap Fillers: Known for their flexibility, wide operating temperature range, and good thermal conductivity. Commonly used in consumer electronics, automotive, and industrial applications.

Non-Silicone Gap Fillers: Used in applications where silicone is undesirable, such as in aerospace or optical devices where silicone outgassing might be a concern. These can be made from materials like urethane or acrylic.

Phase Change Materials (PCMs): These change from a solid to a liquid at a specific temperature, allowing them to flow and fill gaps more effectively as the device heats up. Often used in high-performance computing and power electronics.

Grease and Paste: While not traditional “gap fillers,” these materials fill microscopic gaps between surfaces and are used where very thin layers of thermal interface material (TIM) are required.

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Thermal gap fillers are used across various industries from consumer electronics to the automotive industry. By displacing air, which is a poor thermal conductor, thermal gap fillers reduce thermal resistance and improve the efficiency of heat transfer. This ensures that electronic components operate within safe temperature ranges, enhancing their performance and longevity.

TECHSiL offer a range of solutions for thermal gap filling, which are essential for managing heat in electronic components. Here are some key products and their features:

• Momentive TIS420C: This is a one-component, thermally conductive gap filler that cures at room temperature to form a stable silicone gel. It’s designed for use in thermal interfaces for electronic components in consumer and automotive applications.
  
  
• TIA208R Thermally Conductive Silicone Potting: This material is used for potting and gap filling. It cures to a thermally conductive rubber that adheres well to most substrates without primers, making it suitable for complex shapes and cavities.
  
  
• SilCool TIA241GF: This is another two-component, thermally conductive silicone material used to dissipate heat from electronic devices. It can be used as a liquid-dispensed alternative to thermal pads.

These products help ensure efficient heat transfer and stability in various electronic applications and are just an introudction to what TECHSiL have available. 

For more information or to speak to one of our technical team contact us on technical@techsil.co.uk.

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