Momentive Snapsil™ Electronics Bonding

SNAPSIL silicone adhesive sealants from Momentive Performance Materials enable electronics and electrical component manufacturers to optimise production speed and adhesion quality without exposing sensitive components to potentially damaging heat-cure processing. These room-temperature, condensation-cure adhesives form a strong bond to most substrates used in electronic components, including metals, polymer resins and glass. Their short, tack-free times can contribute to productivity in high-volume manufacturing.

Available in both one- and two-component formulations, SNAPSIL adhesive sealants offer quick tack time, low volatility and primer-less application with low odour and excellent adhesion.

The SNAPSIL range includes adhesives in both paste and flowable form which are noncorrosive to most metals. Typical applications include insulating adhesive seals and fixatives for electrical and electronic parts; as a waterproof sealant for electrical, electronic and communication equipment; or as a general adhesive for many metals, plastics and glass. Used by customers in the automotive, consumer electronics components, solar and energy industries.

Specific SNAPSIL grades also offer special features, such as flame retardance and thermal conductivity for bonding in power supplies, adhesion between electronic components and heat sinks, or securing PCBs to substrates.

For more information or to speak to one of our technical team contact us on technical@techsil.co.uk.