Momentive SilCool™ Thermal Management

In response to new heat-management challenges TECHSiL, in partnership with the scientists at Momentive Performance Materials, are proud to offer SILCOOL™ Thermal Interface Materials.

Characterised by excellent thermal conductivity and consistent, long-term heat transfer performance; SILCOOL™ products can enable such devices to operate more efficiently and reliably. The range includes grease compounds, adhesives, encapsulants, potting compounds and liquid dispensed thermal pads. Offering excellent workability, thin bond lines, minimal weight loss at elevated temperatures, low bleed and great stability.

SILCOOL™ silicone products are excellent candidates for electronic and other applications where thermal management and high-heat transfer are critical.

Used across many industries, such as energy, power, utilities, telecom, microelectronics, aerospace, automotive, renewable energy, consumer electronics and health care. Potential applications include assembly adhesion, board assembly and manufacturing of flat-panel monitors, photovoltaic components and hybrid car parts.

White Paper: SilCool™ Thermal Gap Fillers in Vibration Testing

Momentive Thermal Silicones Brochure

For more information or to speak to one of our technical team contact us on technical@techsil.co.uk.