Advanced Thermal Silicones for EV and AV Applications
TECHSiL recently showcased an exciting range of thermal materials at the Battery Cells & Systems Expo.More infomration below.
TIA225GF Liquid-Dispensed Silicone Thermal Pad
TIA225GF silicone is a two-component thermally conductive material that is dispensed as a liquid and cured in place to create a heat path for efficient heat transfer. After being applied, its non-slumping pasty consistency provides physical stability to help prevent run-off after being dispensed. TIA225GF can be used as a liquid-dispensed alternative to pre-fabricated thermal pads, and as a gap filler for a broad array of thermal designs in electronic components.
TIA208R Thermally Conductive Silicone Potting
TIA208R is a 2-component, thermally conductive material used for potting and gap filling. When cured at room temperature or quickly with heat, it cures to a thermally conductive rubber that adheres well to most metal and plastic substrates without the need for primers. The flowability of TIA208R allows it to conform to complex 3-dimenstional shapes and cavities, filling voids and thereby creating a thermal path to remove heat.
TN8000 Fast Cure, Non-corrosive Silicone Adhesive Sealant
TN8000 silicone adhesive sealant is a one-component, fast cure, non-corrosive silicone adhesive sealant that cures on exposure to atmospheric moisture to form an elastic silicone rubber. TN8000 silicone adhesive sealant has a thixotropic paste consistency and excellent corrosion-free adhesion to metals, including copper, plastics, glass without the use of primers.
6101 Heat curable silicone Adhesive
6101, is a one-component heat curable silicone adhesive sealant which will bond to many substrates without a primer and which will cure rapidly at elevated temperatures. This product has a very long working time at room temperature and will not cure completely until exposed to elevated temperatures. 6101 silicone adhesive is a black, thixotropic paste, which can be applied to vertical or overhead surfaces.
TIA241GF Liquid-Dispensed Silicone Thermal Pad / Gap Filler
TIA241GF gap filler is a 2-component, soft, thermally conductive silicone material used to dissipate heat from electronic devices. Its non-slumping pasty consistency offers physical stability that can allow improved processing. TIA241GF gap filler can be used as a liquid dispensed alternative to pre-fabricated thermal pads in a broad array of thermal designs for electronic applications.
SN1001 High Elongation Silicone Gel – Optical Bonder
SN1001 is a two-component, high elongation silicone gel used for optical bonding applications. This product will typically provide tack free time at room temperature in ~10 minutes to a soft, tacky gel with the addition of a curing agent. The soft nature and cushioning effect of this product offers excellent protection of electronic assemblies from external humidity, mechanical shock and vibration.
If you would like any further information on these grades, discuss your application further or sample please contact our technical team direct on technical@techsil.co.uk.