3M™ ScotchWeld™ EC-9323 B/A Epoxy Adhesive 1L

3M™ ScotchWeld™ EC-9323 B/A is a room temperature curing epoxy paste adhesive. It is thixotropic, sag-resistant and creates an impact resistant structural bond.

ScotchWeld™ EC-9323 bonds to a ariety of substrates such as metals, glass, ceramics and plastics, incl. GFRP and CFRP.

Product Benefits

• Thixotropic, non-sag, full room emperature processable
• Toughened system providing very high shear and peel strength
• Excellent environmental resistance

Technical Properties

• Colour: Part B - White, Part A - Off-White
• Base: Part B - Modified epoxy, Part A - Modified amine
• Consistency: Thixotropic paste
• Density: Part B - 1.04g / cm, Part A - 1.03g / cm
• Solids: 100%
• Viscosity: Part B - 250Pas, Part A - 75Pas
• Mix ratio by weight: 100 : 50 wt.